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US based Sealed Air will partner with Ecovative Design to jointly produce, sell and distribute the new packaging material from Ecovative called EcoCradle Mushroom Packaging. The material is home compostable and is cost effective since it is made of renewable and non-food agricultural materials.
At present many Fortune 500 companies are using the product. The material has also won many important awards such as the DuPont Packaging Innovation Diamond Award, “Best of What’s New” from Popular Science and Greener Package “Innovator of the Year” award.
According to the President of the Protective Packaging Business division of Sealed Air Ecovative has the ability to alter the characteristics of materials in terms of its density, texture, appearance and strength in order to meet the specifications of its customers. He also added that a combination of Sealed Air’s expertise and Ecovative’s technology will help them to enhance innovations and meet their customer needs in a better manner. Sealed Air owns various other brands such as Bubble Wrap, Cryovac for food packaging and Diversey for cleaning. Ecovative was formed at the Rensselaer Polytechnic Institute with major investments from DOEN Foundation and 3M Company. The company was named the Tech Pioneer at the World Economic Forum held in Davos, Switzerland during 2011.
According to the President of the Protective Packaging Business division of Sealed Air Ecovative has the ability to alter the characteristics of materials in terms of its density, texture, appearance and strength in order to meet the specifications of its customers. He also added that a combination of Sealed Air’s expertise and Ecovative’s technology will help them to enhance innovations and meet their customer needs in a better manner. Sealed Air owns various other brands such as Bubble Wrap, Cryovac for food packaging and Diversey for cleaning. Ecovative was formed at the Rensselaer Polytechnic Institute with major investments from DOEN Foundation and 3M Company. The company was named the Tech Pioneer at the World Economic Forum held in Davos, Switzerland during 2011.
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